What are the requirements for halogen-free and lead-free high temperature solder pastes?

As we all know, Halogen Free Solder Paste is a halogen-free, lead-free, no-clean solder paste tailored for SMT process. Before such products are put into use, they must be certified by SGS and other international authoritative organizations to strict standards. At present, the European Union has issued relevant regulations, stipulating that most electronic products need to meet the halogen-free requirements. In product selection, many companies tend to choose lead-free environmentally friendly solder paste, some companies have more stringent restrictions on halogen content. Next, Nofert solder paste manufacturers will explain the relevant content in detail:

Halogen-free, that is, HalogenFree (HF), the concept originated from a strong sense of environmental protection countries to limit the use of specific halogenated requirements. The requirement stipulates that the halogen content (including fluorine, chlorine, bromine and iodine) in the product must be less than 900 ppm respectively, and the total is less than 1500 ppm, otherwise it is regarded as substandard. In fact, the application of halogens in polymer products, such as plastics, can enhance their ignition point, which has the following advantages: Compared with ordinary polymer materials, their ignition point is higher, usually up to 300℃. During combustion, halogens form halogenated gases (e.g., fluorine, chlorine, bromine, iodine, etc.), which rapidly absorb oxygen and thus help to extinguish fires. However, at high levels of halogens, excessive concentrations of chlorine gas released may lead to reduced visibility, making escape routes difficult to recognize, and chlorine gas is also strongly toxic and may affect respiratory health. In addition, halogenated gases released during combustion of halogen-containing polymers combine with water vapor to produce corrosive and harmful gases (e.g., hydrogen halides) that may cause damage to equipment and buildings. Therefore, excessive halogen content is not only harmful to products, but may also pose a threat to human health. The halogen-free and lead-free high-temperature solder pastes produced by Neufeld solder paste manufacturers comply with the halogen-free standard, and some of the models of these products have realized nearly zero halogen content. At the same time, these products also strictly comply with the requirements of the environmental protection RoHS2.0 directive.

The advantages of LFP-JJY1KR-0307T4 halogen-free lead-free high-temperature solder paste produced by Suzhou Neufeld are mainly reflected in the following aspects:

1, LFP-JJY5RR-0307T4 (Pb content of less than 100ppm) type halogen-free lead-free high-temperature solder paste, using Sn99.3Ag0.3Cu0.7 lead-free tin alloy and low oxidation spherical solder powder carefully made with excellent environmental performance. In addition, the paste is refined with high-quality imported chemical materials to ensure the high stability and excellent effect of the paste.

2, the product shows excellent film release performance in the printing process, with excellent drying resistance and good thixotropic properties. It is suitable for printing pads with a pitch of ≥0.3mm, and is particularly suitable for fine pitch, QFN and BGA and other high-density device mounting operations.

3, the product is resistant to high temperatures up to 300 degrees Celsius and still maintains a stable color, less residue after soldering and transparent, non-corrosive properties, and show excellent surface insulation resistance performance. In addition, without cleaning to achieve excellent ICT test results, and halogen content control in the halogen-free standard limit value of 900ppm or less.

 4, in the continuous printing process, the viscosity fluctuation amplitude is small, effectively ensuring the stability of the printing effect for a long period of time. 5, the product has excellent thixotropic properties, printing is completed, its form is stable, not easy to collapse, effectively preventing the SMD components displacement phenomenon.

 6, after welding the solder joint presents a bright state, excellent conductivity performance, gold-plated plate and QFN package climbing tin fullness have reached a high standard. 7, the welding process, the generation of tin beads significantly reduced, effectively reducing the incidence of short-circuit events. Nofer solder paste manufacturer is committed to producing all kinds of high-quality tin solder products, covering lead-free solder paste, halogen-free solder paste, silver-containing leaded solder paste, syringe solder paste, nickel-plated environmentally friendly tin wire and tin rods and so on. We not only provide diversified product choices, but also provide professional technical support. If you have any needs or technical questions about solder, please feel free to contact us through the online message, looking forward to interacting with you!